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om Chip Resistor Array.c EXB1 : 0201 Array 4U EXB2 : 0402t Array EXB3 : 0603 Array ee EXBN S0402 Array :h EXBV : 0603 Array ta : 0805 Array a EXBS D . n Features w w w
Type: l High density 2 resistors in 4 resistors in 2 resistors in 4 resistors in 8 resistors in 2 resistors in 4 resistors in 4 resistors in 0.8 mm 0.6 mm 1.4 mm 0.6 mm 1.0 mm 1.0 mm 2.0 mm 1.0 mm 3.8 mm 1.6 mm 1.6 mm 1.6 mm 3.2 mm 1.6 mm 5.1 mm 2.2 mm size size size size size size size size
Chip Resistor Array
l Improvement of placement efficiency Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor
n Explanation of Part Numbers
1 2 3
E
Product Code Thick Film Chip Resistor Networks 1 2 3 V S
N
n Construction (Example : Concave Terminal)
Protective coating
m o .c U t4 e e h S ta a .D w w w
4 5 6 7 8 9 10 11
(EXB14V) (EXB18V) (EXB24V) (EXB28V, N8V) (EXB2HV) (EXB34V, V4V) (EXB38V, V8V) (EXBS8V)
X
B
V
8
V
4
7
2
J
V
Chip Resistor Array Type: inches
No. of Terminal 4 8
Schematics V type
Resistance Value
Resistance Tolerance J 0
Packaging Methods Packaging Embossed Carrier Taping (S8V) Punched Carrier Taping 2 mm pitch (14V, 18V, 24V, 28V, N8V) Punched Carrier Taping 4 mm pitch (2HV, 34V, 38V, V4V, V8V)
4 Terminal 8 Terminal
Isolated
The first two digits are significant figures of resistance value and the number of zeros following. Jumper is expressed by R00
Code Nil
0201 Array 0402 Array 0603 Array 0402 Array 0603 Array 0805 Array
5 %
Convex Terminal
H 16 Terminal
the third one denotes
Jumper
Concave Terminal
X
Example: 222: 2.2 k
9
V
n Schematics
l Isolated type 2 resistors
" !
14V, 24V, 34V, V4V
18V, 28V, N8V, 38V, V8V, S8V 4 resistors
% $ & #
Alumina substrate
2HV
Thick film resistive element
Electrode (Outer) Electrode (Between)
8 resistors
$ # " !
Electrode (Inner)
!
Design and specifications are each subject to change without notice.
Ask factory for the current technical specifications before purchase and/or us
Should a safety concern arise regarding this product, please be sure to contact us immediately.
om .c U t4 ee Sh ta a D . w w w
! "
' " # $ % &
e.
Chip Resistor Array
n Dimensions in mm (not to scale)
(1) Convex Terminal type
A1
EXB14V, 24V, 34V
A1
A2
EXB28V, 38V
B
G
B
G
T
G
W
P L A1 A2
T
P L
EXB2HV
B G
B
P
L
T
G
W
Type (inches) EXB14V (02012) EXB24V (04022) EXB28V (04024) EXB2HV (04028) EXB34V (06032) EXB38V (06034) L 0.800.10 1.00 3.80 3.20
0.10
Dimensions (mm) W 0.600.10 1.00 1.60 1.60
0.10
B
G
B
W
Mass (Weight) B 0.150.10 0.18 0.30 0.30
0.10
T 0.350.10 0.35 0.45 0.50
0.10
A1 0.350.10 0.40 0.35 0.65
0.10
A2 N N 0.350.10 0.35 0.45
0.10
P (0.50) (0.65) (0.50) (0.50) (0.80) (0.80)
G 0.150.10 0.25 0.30 0.35
0.10
[g/1000 pcs.] 0.5 1.2 2.0 9.0 3.5 7.0 ( ) Reference
2.000.10
0.10
1.000.10
0.10
0.350.10
0.10
0.450.10
0.10
0.200.10
0.10
0.250.10
0.10
1.600.20
0.20
1.600.15
0.15
0.500.10
0.10
0.650.15
0.15
N
0.15
0.300.20
0.20
0.300.20
0.20
(2) Concave Terminal type
A1
EXBV4V
B G
A1
A2
EXBN8V, V8V, S8V
B G T G W
G
W
B
P L
T
P
L
Type (inches) EXBN8V (04024) EXBV4V (06032) EXBV8V (06034) EXBS8V (08054) L 2.000.10 1.60 5.08
+0.20 0.10
Dimensions (mm) W 1.000.10 1.60 2.20
+0.20 0.10
B
Mass (Weight) B 0.200.15 0.30 0.50
0.15
T 0.450.10 0.60 0.70
0.10
A1 0.300.10 0.60 0.80
0.10
A2 0.300.10 N 0.600.10 0.80
0.15
P (0.50) (0.80) (0.80) (1.27)
G 0.300.15 0.45 0.70
0.15
[g/1000 pcs.] 3.0 5.0 10 30 ( ) Reference
3.20+0.20 0.10
+0.20 0.10
1.60+0.20 0.10
+0.20 0.10
0.600.10
0.20
0.600.10
0.15
0.300.15
0.15
0.450.15
0.15
(3) Flat Terminal type
A1 A2
EXB18V
B G
T
P
L
B
G
W
Type (inches) EXB18V (02014) L 1.400.10 W 0.600.10 T 0.350.10
Dimensions (mm) A1 0.200.10 A2 0.200.10 B 0.100.10 P (0.40) G 0.150.10
Mass (Weight) [g/1000 pcs.] 1.0 ( ) Reference
Design and specifications are each subject to change without notice.
Ask factory for the current technical specifications before purchase and/or us
e.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Array
n Ratings
Item Resistance Range Resistance Tolerance 14V,24V,V4V,34V Number of Terminal 18V,28V,N8V,38V,V8V,S8V 2HV 14V,24V,V4V,34V Number of Resistors 18V,28V,N8V,38V,V8V,S8V 2HV 14V,28V,N8V 18V Specifications 10 W to 1 MW: E24 series J: 5 % 4 terminal 8 terminal 16 terminal 2 resistors 4 resistors 8 resistors 0.031 W/element 0.031 W/element (0.1 W/package) 0.1 W/element 0.063 W/element (0.25 W/package) Category Temperature Range (Operating Temperature Range) Jumper Array Rated Current 55 uC to 125 uC T.C.R. Max. Over-load Voltage(2) Item Specifications 14V,18V 12.5 V Limiting Element Voltage (1) 2HV 25 V Max. Rated Continuous 24V,28V,N8V,38V,34V,V4V,V8V 50 V Working Voltage S8V 100 V
(
)
14V,18V 2HV
25 V 50 V
24V,28V,N8V,38V,34V,V4V,V8V 100 V S8V 200 V 200 106/uC(ppm/uC)
Power Rating at 70 C 24V,V4V,34V,V8V,38V 0.063 W/element S8V 2HV
0.5 A 14V,18V 2HV,24V,28V,N8V,38V,34V,V4V,V8V 1 A 2A S8V
1A 14V,18V Max. Overload Current 2HV,24V,28V,N8V,38V,34V,V4V,V8V 2 A 4A S8V
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= OPower Rating Resistance Value, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload (Voltage) listed above whichever less.
n Packaging Methods (Taping)
l Standard Quantity Type EXB14V, 18V EXB24V, 28V EXBN8V EXB2HV EXB34V, 38V EXBV4V, V8V EXBS8V Embossed Carrier Taping Punched Carrier Taping 4 mm 5000 pcs./reel 2500 pcs./reel 2 mm 10000 pcs./reel Kind of Taping Pitch (P1) Quantity
Design and specifications are each subject to change without notice.
Ask factory for the current technical specifications before purchase and/or us
Rated Load (%)
Power Derating Curve For resistors operated in ambient temperature above 70 C, power rating shall be derated in accordance with the right figure.
55 C 70 C 100 80 60 40 20 125 C 0 60 40 20 0 20 40 60 80 100 120 140 160 180 Ambient Temperature (C)
e.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Array
l Carrier Tape
Punched Carrier Embossed Carrier
BD 0
P1 P2 P0
Unit (mm)
F
E
B
T
T
A
P1
(2 mm pitch)
BD 1
(Only Emboss)
Type EXB14V EXB18V EXB24V EXB28V EXBN8V EXB2HV EXB34V EXB38V EXBV4V EXBV8V EXBS8V
A 0.70+0.10 -0.05
B 0.90+0.10 -0.05 1.600.10 1.200.10
W
F
E
P1
P2
P0
fD0
W
T 0.520.05
fD1
2.000.10
1.200.10
2.200.10 4.100.15 1.950.20 8.000.20 3.500.05 1.750.10 2.000.05 4.000.10 1.50+0.10 -0 _ 0.700.05
1.95
0.15
3.600.20 1.950.20 3.600.20
4.000.10 0.840.05 12.000.30 5.500.20 1.60 max. 1.50+0.10 -0
2.800.20
5.700.20
l Taping Reel
6
Unit (mm)
Type EXB14V,18V EXB24V,28V EXBN8V EXB2HV EXB34V,38V EXBV4V,V8V EXBS8V fA fB fC W T
B+
180.0+0 60 min. -3.0
13.01.0
9.01.0
11.41.0
B*
13.01.0
15.42.0
B)
9
n Land pattern design Recommendable land pattern design for Network chip is as shown below figure. (Not to scale) Type
B =
Dimensions a 0.30 0.30 0.5 b 0.30 0.20 c 0.30 0.20 p 0.50 0.40 0.65 0.80 0.80 1.27
Unit (mm) f 0.90 0.90 1.4 to 1.5 2 to 2.4 2.2 to 2.6 3.2 to 3.8
14V 18V 24V
> F ?
0.35 to 0.40 0.35 to 0.40
V4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45 34V,38V 0.7 to 0.9 0.4 to 0.5 0.4 to 0.5 S8V 1 to 1.2 0.5 to 0.75 0.5 to 0.75
Design and specifications are each subject to change without notice.
Ask factory for the current technical specifications before purchase and/or us
e.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Resistor Array
B
=
B
=
>
@
?@
?@
>
(Not to scale) Unit (mm) d 0.25 0.25 f 1.40 1.40 to 2.00 Type 2HV
>
@?@ ?@ ?@ ?@ ?@
?@
>
Type 28V N8V
Dimensions a 0.40 b 0.525 c 0.25 0.25
(Not to scale) Dimensions a 1.00 b 0.425 c 0.25 d 0.25 Unit (mm) f 2.00
0.45 to 0.50 0.35 to 0.38
n Recommended Soldering Conditions Recommendations and precautions are described below. l Recommended soldering conditions for reflow aReflow soldering shall be two times maximum. aPlease contact us for additional information when you use in conditions other than those specified. aPlease measure a temperature of terminations and study solderability every kind of solder and board, before actual use.
Peak Temperature Preheating Heating
For solder (Example : Sn/Pb) Temperature Preheating Main heating Peak 140 C to 160 C Above 200 C 235 5 C Time 60 s to 120 s 30 s to 40 s max. 10 s
For lead-free solder (Example : Sn/Ag/Cu) Temperature Time Preheating Main heating Peak 150 C to 180 C Above 230 C max. 260 C 60 s to 120 s 30 s to 40 s max. 10 s
l Flow soldering aWe can not recommended the flow soldering, because we are afraid that solder bridge happen.
Time
Cautions for Safety
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. Take measures against mechanical stress during and after mounting of Chip Resistors Array (hereafter called the Resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the Resistors on the land patterns. Otherwise, solder bridges may be caused. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the Resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the Resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply a shock to the Resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the Resistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bend of printed circuit boards in order to protect the Resistors from abnormal stress.
Design and specifications are each subject to change without notice.
Ask factory for the current technical specifications before purchase and/or us
e.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Caution for Safety (Common precautions for Fixed Resistors)
When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. Do not use the products beyond the specifications described in this catalog. This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ] Systems equipped with a protection circuit and a protection device ] Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use These products are designed and manufactured for general purpose and standard use in general electronic equip ment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. In an environment where strong static electricity or electromagnetic waves exist 5. In an environment where these products cause dew condensation 6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the perfor mance or reliability of the products. Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight
Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English.
- ER3 -

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